Mr. Man-Hyup Han | Wafer Polishing | Best Researcher Award
Mr. Man-Hyup Han | Hanyang University | South Korea
Mr. Man-Hyup Han is a dedicated researcher specializing in advanced semiconductor processing, with a focus on the development and optimization of chemical–mechanical polishing (CMP) technologies. With strong expertise in material science, chemical engineering, and semiconductor manufacturing, his career has been characterized by bridging fundamental research and industrial application. His work emphasizes improving process performance, reducing surface defects, and ensuring high reliability in integrated circuit fabrication. Through his ongoing contributions in CMP slurry formulation and process integration, he has demonstrated a significant commitment to advancing next-generation semiconductor technologies.
Professional Profile
SCOPUS
Summary of Suitability
Mr. Man-Hyup Han is a promising researcher specializing in chemical–mechanical polishing (CMP) technology for advanced semiconductor fabrication. With a solid academic foundation from Hanyang University and hands-on research experience at ASMDDC, he has demonstrated strong capabilities in both scientific innovation and practical application.
Education
He began his academic journey at Hanyang University in Seoul, where he completed his Bachelor’s degree, gaining a solid foundation in material and chemical engineering. Building upon this, he continued at Hanyang University in an integrated Master’s and Doctoral course, where his research centers on advanced CMP techniques for semiconductor applications. This rigorous academic environment has enabled him to develop both theoretical knowledge and practical expertise, positioning him at the intersection of academia and industry. His education reflects not only technical depth but also a strong commitment to innovation in nanomaterials and surface engineering within the semiconductor field.
Experience
Professionally, he has been serving as a researcher at Hanyang University’s Advanced Semiconductor Materials and Device Development Center (ASMDDC) since 2021. His responsibilities include designing and formulating CMP slurries tailored for metals such as copper, tungsten, silver, and aluminum, as well as for organic films and SiO₂ substrates. He has optimized processes by carefully adjusting abrasive particle systems, oxidizers, complexing agents, and functional additives to meet the stringent requirements of semiconductor device fabrication. His experience extends to analyzing defectivity issues such as dishing, erosion, and scratches, while also enhancing removal rates and selectivity. Furthermore, he has actively participated in collaborative projects addressing process integration challenges and manufacturability improvements, where his insights have contributed to cost reduction and yield enhancement. His professional journey highlights his ability to translate laboratory findings into practical industrial applications.
Research Interests
His research interests revolve around chemical–mechanical polishing technology, semiconductor materials processing, defect control, and slurry chemistry optimization. Specifically, he focuses on designing novel slurry formulations that provide superior selectivity and surface quality while minimizing defectivity. He is also interested in the interplay between chemical reactions and mechanical abrasion at the nanoscale, which is central to improving CMP performance. Additionally, his research addresses process reliability and cost-effectiveness in semiconductor manufacturing, aiming to create scalable solutions that support the advancement of ultra-large-scale integration (ULSI) and next-generation devices.
Awards
His achievements have been recognized through academic and institutional awards that highlight his contributions to research excellence and innovation in semiconductor process technologies. These honors demonstrate not only the scientific merit of his work but also his growing reputation as a promising researcher in the field of CMP and semiconductor fabrication.
Publication Top Notes
The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4′-Oxydianiline to Remarkably Enhance the Chemical–Mechanical Planarization Polishing Rate
Conclusion
Mr. Man-Hyup Han stands out as a promising researcher whose expertise and dedication contribute significantly to semiconductor manufacturing innovation. His educational background, professional experience, and focused research interests highlight his ability to address complex challenges in CMP processes and slurry development. Through his academic achievements, publications, and recognized awards, he has demonstrated not only technical skill but also leadership in advancing the understanding and application of CMP technologies. His work continues to support the reliability, performance, and cost-effectiveness of semiconductor devices, making him a deserving nominee for recognition in research and innovation awards.