Dr. George Alexandru Boldeiu, IMT Bucharest, Romania
George Alexandru Boldeiu is a Romanian researcher specializing in microtechnology, MEMS devices, and thermal-electromagnetic simulations. He is currently an IDT II at the Micromachined Structures, Microwave Circuits, and Devices Laboratory at the National Institute for Research and Development for Microtechnologies in Bucharest. With extensive experience in thermal, mechanical, and electromagnetic simulations using Ansys and COMSOL, his work focuses on surface acoustic wave (SAW) devices, temperature and magnetic sensors, and microwave characterization. Prior to this, he worked as a thermal simulation engineer at Continental Automotive Romania, where he contributed to thermal modeling and optimization of electronic components. He holds a Bachelor’s degree in Mathematical Engineering from the University Politehnica of Bucharest and a Bachelor’s degree in Physics from the University of Bucharest. Currently, he is pursuing a Ph.D. at the Doctoral School of Electronics, Telecommunications & Information Technology at the University Politehnica of Bucharest. His research interests span classical mechanics, quantum mechanics, solid-state physics, and electromagnetism, with expertise in CAD/CAE tools such as Ansys, COMSOL, and SolidWorks.
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Summary of Suitability for Best Researcher Award
George Alexandru Boldeiu has a solid research background spanning over two decades in microtechnology, MEMS (Micro-Electro-Mechanical Systems), and electromagnetic simulations. His experience includes working at the National Institute for Research and Development for Microtechnologies in Bucharest and Continental Automotive Romania, where he conducted advanced simulations in thermal, mechanical, and electromagnetic domains.
🎓 Education
📍 PhD Student (2020 – Present)
Doctoral School of Electronics, Telecommunications & Information Technology, University Politehnica of Bucharest
📍 Bachelor of Physics (2011 – 2014)
Faculty of Physics, University of Bucharest, Bucharest
📍 Bachelor of Mathematical Engineering (1996 – 2001)
Faculty of Electrical Engineering, University Politehnica of Bucharest
💼 Work Experience
🔬 IDT II (2019 – Present)
Micromachined Structures, Microwave Circuits and Devices Laboratory, National Institute for Research and Development for Microtechnologies, Bucharest
- 🔥 Thermal, mechanical, and electromagnetic simulation using Ansys & COMSOL
- 📡 Simulation of MEMS and acoustic wave-based devices
- ⚡ Electromagnetic field simulation (low & high frequency)
- 🎨 3D printing design & electric measurements
- 🌡️ SAW devices on III-nitride layers, microwave characterization, and SAW sensors
💻 Thermal Simulation Engineer (2017 – 2019)
Continental Automotive Romania (ADAS)
- 🔥 Thermal modeling using Ansys & Icepak
- 🏗️ Coupled thermal-structural and thermal-electric analysis
- 💡 Worked on cooling solutions with mechanical and system engineers
🖥️ Engineer (2007 – 2017)
Simulation, Modelling & Computer-Aided Design Laboratory, National Institute for Research and Development for Microtechnologies, Bucharest
- 🎯 Thermal, mechanical, and electromagnetic simulation
- 🛠️ MEMS device simulations & 3D printing design
- ⚡ Electromagnetic field analysis
🗄️ Database Administrator (2004 – 2007)
Internet/Intranet Laboratory, National Institute for Research and Development for Microtechnologies, Bucharest
🔬 Junior Researcher (2001 – 2004)
Nano-Scale Structuring and Characterization, National Institute for Research and Development for Microtechnologies, Bucharest
🏆 Achievements & Honors
- 📡 Significant contributions to SAW devices and MEMS simulation research
- 🔍 Expertise in coupled multiphysics simulations (thermal-electrical-structural)
- 🏅 Extensive experience in CAD/CAE tools for advanced modeling
- 🛠️ Development of rapid-prototyping designs for research applications
Publication Top Notes:
GaN membrane supported SAW pressure sensors with embedded temperature sensing capability
CITED:47
The behavior of gold metallized AlN/Si-and AlN/glass-based SAW structures as temperature sensors
CITED:23
Applications of electrostatic capacitance and charging
CITED:20
Investigation of temperature sensing capabilities of GaN/SiC and GaN/sapphire surface acoustic wave devices
CITED:16
Characterization and modeling of quantum dot behavior in FDSOI devices
CITED:15