Prof. Wenchao Tian, Xidian University, China
Professor Wenchao Tian is a renowned academic and Ph.D. supervisor at Xidian University, where he founded and leads the national-level “Electronic Packaging Technology” specialty, recognized as a “First-class National Specialty” program—the only 5-star program in its field in China. As a key figure at Xidian University, which offers the country’s sole national-level specialty in electronic packaging, Professor Tian plays a pivotal role in advancing the field. He is also a member of the National Key Laboratory of High-Performance Electronic Equipment Electromechanical Integration Manufacturing and serves as the Executive Deputy Director of the Academic Committee of the Xi’an Key Laboratory of Intelligent Instruments and Packaging Testing. In addition, he directs the Research Center for Advanced Packaging and Complex High-Density Assembly.
Professional Profile:
SCOPUS
Suitability of Wenchao Tian for the Best Researcher Award
Based on Wenchao Tian’s extensive contributions and achievements in electronic packaging and related fields, he stands out as an ideal candidate for the Best Researcher Award. His work encompasses a range of advanced research, leadership, and academic excellence that meets and exceeds the typical criteria for such awards. Here’s why:
🎓 Educational Background:
- 1987.9-1991.7: Bachelor’s in Electronic Equipment Structure, Xidian University
- 1996.9-1999.6: Master’s in Mechanical Manufacturing, Xidian University
- 2000.9-2004.6: Ph.D. in Mechanical Manufacturing and Automation, Xidian University
- 2006.12-2007.12: Visiting Scholar at the University of Freiburg, Germany 🇩🇪 (National Study Abroad Program)
- 2006.10-2008.10: Postdoctoral Research in Microelectronics and Solid-State Electronics at Xidian University
🔬 Professional Affiliations:
- Chief Science Communication Expert (MEMS/NEMS & Electronic Packaging), China Association for Science and Technology 🧑🔬
- Member of the National MEMS Standardization Technical Committee
- Council Member of the China Society for Micron and Nanotechnology
- Vice Chairman of the Special Micro/Nano Devices and Systems Branch of the China Society for Micron and Nanotechnology
- Head of the Talent Group for Sensor Packaging and Testing Technology Committee of the China Sensor and IoT Industry Alliance
- Reviewer for National Science and Technology Awards, major national projects, and the National Natural Science Foundation of China (NSFC) 🏅
💼 Research and Projects:
Professor Tian has led over 60 projects, including grants from the NSFC, the Ministry of Science and Technology, and collaborations with companies like Huawei 📱. He has published more than 150 SCI-indexed papers 📄, holds 27 invention patents 🧠, and has won several prestigious awards 🏆, including the Second Prize in the Shaanxi Provincial Science and Technology Awards and the First Prize in the Higher Education Science and Technology Awards of Shaanxi Province. His work has also contributed to 7 international standards 🌐 and over 20 national standards.
Publication top Notes:
Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging
Study on Single Event Effects of Enhanced GaN HEMT Devices under Various Conditions
Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling
Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review
Surface oxygen vacancy engineering in weak Bi-O bonded ferroelectric bismuth sodium titanate for boosting the photocatalytic CO2 reduction reaction
Delamination of Plasticized Devices in Dynamic Service Environments
Surface roughness analysis of Cu seed layer deposited on α-Ti diffusion barrier layer: A molecular dynamics simulation study