Prof. Wenchao Tian | Chip Stacking Award | Best Researcher Award

Prof. Wenchao Tian | Chip Stacking Award | Best Researcher Award 

Prof. Wenchao Tian, Xidian University, China

Professor Wenchao Tian is a renowned academic and Ph.D. supervisor at Xidian University, where he founded and leads the national-level “Electronic Packaging Technology” specialty, recognized as a “First-class National Specialty” program—the only 5-star program in its field in China. As a key figure at Xidian University, which offers the country’s sole national-level specialty in electronic packaging, Professor Tian plays a pivotal role in advancing the field. He is also a member of the National Key Laboratory of High-Performance Electronic Equipment Electromechanical Integration Manufacturing and serves as the Executive Deputy Director of the Academic Committee of the Xi’an Key Laboratory of Intelligent Instruments and Packaging Testing. In addition, he directs the Research Center for Advanced Packaging and Complex High-Density Assembly.

Professional Profile:

SCOPUS

 

Suitability of Wenchao Tian for the Best Researcher Award

Based on Wenchao Tian’s extensive contributions and achievements in electronic packaging and related fields, he stands out as an ideal candidate for the Best Researcher Award. His work encompasses a range of advanced research, leadership, and academic excellence that meets and exceeds the typical criteria for such awards. Here’s why:

🎓 Educational Background:
  • 1987.9-1991.7: Bachelor’s in Electronic Equipment Structure, Xidian University
  • 1996.9-1999.6: Master’s in Mechanical Manufacturing, Xidian University
  • 2000.9-2004.6: Ph.D. in Mechanical Manufacturing and Automation, Xidian University
  • 2006.12-2007.12: Visiting Scholar at the University of Freiburg, Germany 🇩🇪 (National Study Abroad Program)
  • 2006.10-2008.10: Postdoctoral Research in Microelectronics and Solid-State Electronics at Xidian University

🔬 Professional Affiliations:

  • Chief Science Communication Expert (MEMS/NEMS & Electronic Packaging), China Association for Science and Technology 🧑‍🔬
  • Member of the National MEMS Standardization Technical Committee
  • Council Member of the China Society for Micron and Nanotechnology
  • Vice Chairman of the Special Micro/Nano Devices and Systems Branch of the China Society for Micron and Nanotechnology
  • Head of the Talent Group for Sensor Packaging and Testing Technology Committee of the China Sensor and IoT Industry Alliance
  • Reviewer for National Science and Technology Awards, major national projects, and the National Natural Science Foundation of China (NSFC) 🏅

💼 Research and Projects:

Professor Tian has led over 60 projects, including grants from the NSFC, the Ministry of Science and Technology, and collaborations with companies like Huawei 📱. He has published more than 150 SCI-indexed papers 📄, holds 27 invention patents 🧠, and has won several prestigious awards 🏆, including the Second Prize in the Shaanxi Provincial Science and Technology Awards and the First Prize in the Higher Education Science and Technology Awards of Shaanxi Province. His work has also contributed to 7 international standards 🌐 and over 20 national standards.

 

Publication top Notes:

Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging

Study on Single Event Effects of Enhanced GaN HEMT Devices under Various Conditions

Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Surface oxygen vacancy engineering in weak Bi-O bonded ferroelectric bismuth sodium titanate for boosting the photocatalytic CO2 reduction reaction

Delamination of Plasticized Devices in Dynamic Service Environments

Surface roughness analysis of Cu seed layer deposited on α-Ti diffusion barrier layer: A molecular dynamics simulation study

Dr. Aikaterini Papadopoulou | IC Design | Best Researcher Award

Dr. Aikaterini Papadopoulou | IC Design | Best Researcher Award

Dr. Aikaterini Papadopoulou, Lawrence Berkeley National Laboratory, United States

Aikaterini Papadopoulou is a distinguished IC design engineer and research scientist at Lawrence Berkeley National Laboratory, currently serving as the IC Design Group Leader since 2024. She earned her PhD in Electrical Engineering and Computer Science from the University of California, Berkeley, in 2017, focusing on variability analysis and yield optimization in deep-submicron mixed-signal circuits. Prior to her current role, Aikaterini contributed significantly to the IC Design group at Lawrence Berkeley National Laboratory from 2017 to 2024, specializing in analog and mixed-signal IC design for high-energy physics, nuclear science, and scientific imaging applications. Her research interests include co-design and integration of nano-sensors on CMOS platforms, and she has made notable contributions to projects such as cryogenic electron-microscopy and particle detectors. Aikaterini also brings experience from her consultancy work at Kandou Bus in Lausanne, Switzerland, where she led the design of high-speed, low-power links for backplanes and cable interconnects. Her technical expertise spans Cadence and Mentor Graphics IC design tools, Verilog HDL, and programming languages including Python, C, and Matlab. Aikaterini Papadopoulou’s career is underscored by her commitment to advancing semiconductor technology and instrumentation in scientific research.

Professional Profile

Education:

  • PhD, Electrical Engineering and Computer Science, University of California at Berkeley, 2017
    Thesis: Variability Analysis and Yield Optimization in Deep-Submicron Mixed-Signal Circuits
  • M.S., Electrical Engineering and Computer Science, University of California at Berkeley, 2011
    Thesis: Characterization of Variability in Deeply-Scaled Fully Depleted SOI Devices
  • B.S/M.S., Electrical and Computer Engineering, University of Patras, Greece, 2009
    Thesis: Design and Implementation of a BCH Decoder for a DVB-S2 receiver

Experience:

  • Lawrence Berkeley National Laboratory, Berkeley, CA
    IC Design Research Scientist/Engineer – IC Design Group Leader, 2024 – Present

    • Leading research and engineering in ASIC instrumentation for High-Energy Physics, Nuclear Science, and scientific imaging.
  • Lawrence Berkeley National Laboratory, Berkeley, CA
    IC Design Engineer, 2017 – 2024

    • Member of the IC Design group specializing in ASIC instrumentation for High-Energy Physics and scientific imaging.
    • Principal Investigator: Co-Design and Integration of nano-sensors on CMOS.
    • Analog and analog/mixed-signal IC design for cryogenic electron-microscopy, particle detectors, neural probes.
    • Analog/mixed-signal verification for ATLAS and CMS inner tracker detector chip.

Positions of Responsibility:

  • Co-organizer, HEPIC Workshop, 2024 –
    • Organizing consortium of IC design engineers and physicists in High Energy Physics instrumentation.

Achievements and Patents:

  • Patent: SINGLE PHOTON COLOR IMAGE SENSOR
    • Co-inventor: Leonard, Francois; Garcia-Sciveres, Maurice; Im, Mi-Young; Mei, Yuan; Nonaka, Andrew; Raja, Archana; Tikhomirov, Grigory
    • U.S. Patent Application Ser. No: 63/256,894 (filed Oct 18, 2021)
    • International Patent Application Ser. No: PCT/US2022/046980 (filed Oct 18, 2022)

Technical Skills:

  • Tools & HDL: Cadence and Mentor Graphics IC design tools, Verilog
  • Languages: Python, C, Matlab, SKILL, TCL
  • Operating Systems: UNIX, LINUX, Windows, Mac OS X

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Publications Notes:📄

A Modular 512-Channel Neural Signal Acquisition ASIC for High-Density 4096 Channel Electrophysiology

Measurements of the radiation damage to the ITkPixV1 chip in X-ray irradiations

Cryogenic Calorimetric Signal Readout with 180nm CMOS at 20 mK

A 512-Channel Neural Signal Acquisition ASIC for High-Density Electrophysiology

X-ray irradiation measurements of the radiation tolerance of the ITkPixV1 ATLAS pixel readout chip

Interfacing with cryogenic sensors via 180 nm CMOS operating near 1 Kelvin