Mr. Man-Hyup Han | Wafer Polishing | Best Researcher Award 

Mr. Man-Hyup Han | Hanyang University | South Korea

Mr. Man-Hyup Han is a dedicated researcher specializing in advanced semiconductor processing, with a focus on the development and optimization of chemical–mechanical polishing (CMP) technologies. With strong expertise in material science, chemical engineering, and semiconductor manufacturing, his career has been characterized by bridging fundamental research and industrial application. His work emphasizes improving process performance, reducing surface defects, and ensuring high reliability in integrated circuit fabrication. Through his ongoing contributions in CMP slurry formulation and process integration, he has demonstrated a significant commitment to advancing next-generation semiconductor technologies.

Professional Profile

SCOPUS

Summary of Suitability

Mr. Man-Hyup Han is a promising researcher specializing in chemical–mechanical polishing (CMP) technology for advanced semiconductor fabrication. With a solid academic foundation from Hanyang University and hands-on research experience at ASMDDC, he has demonstrated strong capabilities in both scientific innovation and practical application.

Education

He began his academic journey at Hanyang University in Seoul, where he completed his Bachelor’s degree, gaining a solid foundation in material and chemical engineering. Building upon this, he continued at Hanyang University in an integrated Master’s and Doctoral course, where his research centers on advanced CMP techniques for semiconductor applications. This rigorous academic environment has enabled him to develop both theoretical knowledge and practical expertise, positioning him at the intersection of academia and industry. His education reflects not only technical depth but also a strong commitment to innovation in nanomaterials and surface engineering within the semiconductor field.

Experience

Professionally, he has been serving as a researcher at Hanyang University’s Advanced Semiconductor Materials and Device Development Center (ASMDDC) since 2021. His responsibilities include designing and formulating CMP slurries tailored for metals such as copper, tungsten, silver, and aluminum, as well as for organic films and SiO₂ substrates. He has optimized processes by carefully adjusting abrasive particle systems, oxidizers, complexing agents, and functional additives to meet the stringent requirements of semiconductor device fabrication. His experience extends to analyzing defectivity issues such as dishing, erosion, and scratches, while also enhancing removal rates and selectivity. Furthermore, he has actively participated in collaborative projects addressing process integration challenges and manufacturability improvements, where his insights have contributed to cost reduction and yield enhancement. His professional journey highlights his ability to translate laboratory findings into practical industrial applications.

Research Interests

His research interests revolve around chemical–mechanical polishing technology, semiconductor materials processing, defect control, and slurry chemistry optimization. Specifically, he focuses on designing novel slurry formulations that provide superior selectivity and surface quality while minimizing defectivity. He is also interested in the interplay between chemical reactions and mechanical abrasion at the nanoscale, which is central to improving CMP performance. Additionally, his research addresses process reliability and cost-effectiveness in semiconductor manufacturing, aiming to create scalable solutions that support the advancement of ultra-large-scale integration (ULSI) and next-generation devices.

Awards

His achievements have been recognized through academic and institutional awards that highlight his contributions to research excellence and innovation in semiconductor process technologies. These honors demonstrate not only the scientific merit of his work but also his growing reputation as a promising researcher in the field of CMP and semiconductor fabrication.

Publication Top Notes